Following the successes of the previous four International Conferences on ALD Applications and China ALD Conferences since 2010, the 5th International Conference on ALD Applications
& 1st Asian ALD Conference (2020 China ALD) will be a three-day meeting, dedicated to the fundamentals and applications of Atomic Layer Deposition (ALD) technology in various fields. It will be held in Wuhan, China, from October 12 to 14, 2020. This conference will feature plenary sessions, oral sessions, poster sessions and industrial exhibitions.
The ALD technique has been widely used and explored in numerous fields such as microelectronics, photoelectronics, optical coating, functional nanomaterials, MEMS/NEMS, energy storage, biotechnology, catalysis technology, and etc.
Thanks for your concern, the program committee is paying a close attendtion to the corona virus threat. We will monitor how the current threat evolves and have the best and the safest location arranged.
In the meantime, the abstract submission is open and we look forward to have your abstracts submitted.
Rong Chen (Huazhong University of Science and Technology, China)
Chang Liu (Wuhan University, China)
Soo-Hyun Kim (Yeungnam University, South Korea)
Abstract Submission Starts:
February 1, 2020
Abstract Submission Ends:
August 31, 2020
Early registration deadline:
July 30, 2020
Online registration deadline:
September 30, 2020